in a big industry
SWAPc (reducing size, weight, power, and cost of components) continues to be a major priority for a variety of industrial markets such as Aerospace and Test & Measurement. Conventional manufacturing approaches (e.g. MEMs semiconductor thin-film) have not been able to miniaturize the majority of components needed by industry due to technical and economic limitations.
Our Amalga™ miniaturization paradigm allows us to integrate many different materials (i.e. metals, magnets, coils) in the device and to design and batch manufacture fully three-dimensional, rugged, and robust industrial products.